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Vertical Return Style Sputtering Equipment SPL-V Series
The vertical sputter type sputtering mass production equipment can handle with small-medium substrate.

  • Features
  • Specifications
  • Applications

Features

  • Vertical return back style with load lock design can always provide high vacuum environment for deposition process and enable the stable evaporation.
  • this provides to evaporate both sides simultaneously and fully automated equipment.
  • this can deal with various shapes of substrate, highly flexible design.

Spec example　SPL-342V

Equipment constitution
load lock chamber, process chamber tray, rack＆pinon transfer method by carrier
Substrate size
W300XH130
Cathode
DC square planar type　2 units　DC５Kw
Operation
Fully automated（vent・transfer・heat up・evaporate）

Applications

  • Electronic parts
  • Crystal device
  • SAW/FBAR
  • Thin film sensor
  • Magnetic recording media
  • Thin film solar cell
  • Others

Contact Us

We can customize the vacuum equipment according to your request, so please contact us.

Inquiries about our products